說明 譯自英文 - 重分佈層是芯片上的額外金屬層，它使集成電路的IO焊盤在芯片的其他位置可用，以便在必要時更好地接觸焊盤。當製造的集成電路，它通常具有一組被引線接合與上述封裝的引腳IO墊。再分佈層是芯片上的額外佈線層，使您能夠從芯片上的不同位置進行接合，從而使芯片到芯片的接合更加簡單。 维基百科（英文) 查看原文說明 查看原文說明 說明 A redistribution layer is an extra metal layer on a chip that makes the IO pads of an integrated circuit available in ... Wikipedia
A redistribution layer (RDL) is used to reroute connections to desired locations. For example, a bump array located in the center of a chip can be redistributed ...
A redistribution layer (RDL) is an extra metal layer on a chip that makes the IO pads of an integrated circuit available in other locations of the chip, ...
